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Chip Package Test Equipment Customized service

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Powerful and reliable packaging capabilities

Independent research and development of AlN substrate based on heat sink materials and unique patch technology, thermal management and thermal stress control technology, solve the chip heat dissipation and further packaging problems, products can be expanded TO COS, TO, SF and Bar module packaging.

638nm TO56

Shenzhen RAYBOW OPTO, a leading semiconductor laser chip solution provider, took the lead in releasing 500mW 638nm red light TO metal package to the market in 2021, which is also the first high-power 638nm device based on domestic red light chip package. Mainly used in laser lighting and display field, has been shipped and commercialized.

905nm TO56

Shenzhen Raybow Optoelectronics Co., Ltd. provides TO metal packaging for the 905nm chip series, which has the advantages of good heat dissipation, high cost performance and good reliability.

905nm SMD

RAYBOW OPTO, a leading semiconductor laser chip solution provider, recently launched a new Surface Mount version (SMD) 905nm pulsed semiconductor laser diode.

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